Vitrified Bonds

• only bond type with a controllable porous layer structure
• excellent transportation of chips and very good coolant feed
• good dimensional stability
• bond hardness, pore size (structure) and pore volume can be designed exactly to the requirements of the grinding process
• conditioning (trueing or profiling) and dressing in a single operation possible
• in many instances a better removal rate than with resinoid bonds is achievable
• vitrified grinding wheels should be used with coolant