Wafer Grinding

Wafer Grinding

Component
	Component:	Wafer
	Dimensions:	Ø 2" - 12"
	Material:	Si, SiC, Sapphire (C-, A- and R-Plane), GaAs, GaN, etc.
Grinding Machine
	Machine:	Disco, Supfina, Okamoto, Strasbaugh, G&N, etc.
	Grinding Op:	thinning (rough- and fine grinding), backgrinding, reclaim grinding
Grinding Tool
	Grinding Tool:	rough grinding: 325 - 550 mesh fine grinding: up to 8500 mesh
Results
	Surface Finish Achieved:	Ra 0.4 - Ra 0.015, depending on tool specification
	Geometry Tolerances Achieved:	TTV <2µm

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